Diamond Bearings For Downhole Drilling Tools

Polycrystalline Diamond bearing technology offers an innovative solution for pumping applications operating in harsh drilling fluid environments. 

More Superhard 's PCD bearings are used for mud motors in downhole drilling tools and other bearing applications. For examples include drilling turbines, mud motors, and other down-hole rotating tools . There are two main types : PDC radial bearing,PDC thrust bearing.

Advantages of diamond bearings :

Higher Wear Resistance than other bearing materials such as WC/Co, SiC, SiN

seal-free, lube-free bearings strengthen pump equipment and reduce downtime.

Long wear life in extremely harsh conditions resistant to corrosive and erosive environments.

Carbide tile and matrix design ensures extended life compared to cladding or welded overlay designs.

PDC cutters (Polycrystalline Diamond Composite) is consist of polycrystalline diamond layer sintered with tungsten carbide substrate under ultra-high temperature and pressure .PCD is diamond grit that has been bonded under high-pressure, high-temperature conditions. PDC cutters are applied to oil and gas drilling, water well drilling, geothermal well drilling, dam construction, coal mining and so on.

Besides 1308 PDC cutter, we can supply you more size PDC cutter with domed PCD layer 1304, 1313,1316 .

For more information about diamond bearings, please contact us at any time.

Email : sales@moresuperhard.com

Web:  http://www.moresuperhard.com/3/PDC-Cutter.html

Diamond Dicing Blades For Semiconductor Industry

Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry. Diamond dicing blade is one of new products developed .

The Type: diamond hub dicing blade and diamond hubless dicing blade

Electroformed dicing  blade	Features:  Easy to handle ultra-thin blade Blade dicing after laser grooving Variety of different grit concentrations  Shows stable processing performance in  high load processing	Hub dicing blade
	Application:  Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)
resin dicing blade	Features:  High processing quality for cutting of hard, brittle materiais Able to precisely control diamond concentration to achieve cutting quality Improved cut quality on hard materials	Hubless dicing  blade
	Application: Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter
metal dicing balde	Features:  High rigidityminimized wavy and slant cutting Able to control diamond concentration to  achieve cutting quality Excellent rigidity and cut quality
	Application:  Electronic parts, Optical devices, semiconductor packages, BGA, CSP,
Electroformed dicing  balde	Features:  Wide selection of blade options Proprietary thin-blade technology Blade thickness - 0.015 mm to 0.3 mm Available for both dicing saws and slicers
	Application:  Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon
Other specification can be produced according to customer’s requirements    sales@moresuperhard.com       www.moresuperhard.com

In addition to diamond dicing blades for semi-conductor & LED industry, More Superhard Products Co,.Ltd also supplies :

Silicon grinding wheels are used for the thinning and fine grinding of the silicon wafer.

Sapphire Grinding wheel for LED substrate 

Back grinding wheel for grinding the back side of sapphire wafer ;

Edge grinding wheel, roller dresser and other others semi-conductor tools .

For more information about diamond dicing blades, plaese contact us at any time.

sales@moresuperhard.com

www.moresuperhard.com