The back resin grinding wheel is used to grind silicon wafers
The back resin silicon wafer thin grinding wheel is mainly used in semiconductor wafer thin and fine processing, the company has advanced equipment, strong technical force, resin silicon wafer thin grinding wheel can reach the import level.
Application:Silicon wafers,wafer,Sapphire, LED, silicon chip
Alias:back grinding wheel,Silicon wafer thinning wheel,resin diamond grinding wheel ,cup wheel,Thinning grinding wheel
Product specifications:
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Binder types: Vitrified , resins, metals
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External diameter of grinding wheel: φ175, φ 195, φ209, φ255, φ305, φ355
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Diamond particle size: 200#, 400#, 800#, 1200# and 1500# 3000 #, 6000 #, 8000 #, 15000 #, 30000 #
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Applicable machine tools: the products can be compatible with DISCO, OKAMOTO, TSK, STRABAUGH and other companies.
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Application:Silicon wafer thinning grinding wheel is mainly used for wafer thinning and fine grinding.The silicon wafer thin grinding wheel developed by our company has excellent grinding performance and high cost performance. It can be used stably in European, American, Japanese and domestic grinding machines and can replace imported products.
Shape code
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Section diagram
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Commonly used specifications
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D
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T
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H
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6A2,6A2H
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175
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30,35
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76
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200
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35
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76
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350
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40
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127
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6A2T
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195
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22.5,25
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170
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280
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30
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228.6
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350
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35
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235
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1A1
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40
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5
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18.7
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Advantages of the back resin grinding wheel is used to grind silicon wafers:
1. High grinding efficiency
2. has a high wear resistance (grinding wheel wear resistance, less abrasive consumption, especially in the grinding of very hard and very fragile workpiece is the most obvious)
3. Low grinding force and low grinding temperature
4, grinding the workpiece precision is high, the surface quality is good, the shape of the workpiece is good
The Cases Of The back resin grinding wheel is used to grind silicon wafers
More SuperHard Products Co., Ltd is dedicated to finding solutions that help our clients in all markets succeed. More SuperHard has been manufacturing high-quality, competitively priced superabrasive diamond and cbn tools that are designed to perform in a wide range of industrial ,such as pcd tools grinding, natural diamond polishing, auto parts processing , thermal spray coated industry, optical glass, semicon and led industry, woodworking tool , cnc tool grinding and roll machining ,others ultral precision industry.
The company production and sales of products covered vitrified bond tools, resin bond tools, metal bond tools, electroplated diamond/cbn tools, vaccum brazed products, cvd diamond tools, polycrystalline diamond (pcd) tools, cubic boron nitride (cbn) tools.our objective is to meet all the customers’ needs and help every customer achieve maximum benefits. more brings in revenue for you, you win, we win!
More SuperHard supplies the wheels for several application mainly
* Carbide round tools on cnc machines : flute grinding, gash grinding, end facing, clearance angle and cylindrical grinding .
* Insert grinding for machines such as: agathon, wendt, haas, waida and ewag.
* Woodworking saw blade and tools .
* Hss tools
* Cutting wheels
many more which can be produced as customer design ,and can be found in our catalogue.
If you have any questions, please feel free to contact us at any time
More Super Hard Products Co., Ltd
Add： No. 171 Zhongyuan Rd, Zhongyuan District, Zhengzhou,450000, Henan, China
Tel: 86-0371-8654-5906
Whats App / Wechat: 86 13323855288
E-mail: sales@moresuperhard.com
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